Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate
2000-04-11
2002-02-12
Le, Que T. (Department: 2878)
Radiant energy
Photocells; circuits and apparatus
Photocell controlled circuit
C250S208100, C250S216000
Reexamination Certificate
active
06346700
ABSTRACT:
BACKGROUND AND SUMMARY OF THE INVENTION
When an energetic particle passes through silicon, a trail of electron-hole pairs is created along the particle's path. Similarly, X-ray photons produce a cloud of electron-hole pairs near the location of the photon's absorption. For high energy particles and X-rays (above 10 keV), it has been observed that one electron-hole pair is created for every 3.61 eV of energy deposited in the silicon. This value comes from the 1.1 eV required to raise an electron over the silicon band gap, plus the kinetic energy of the electron and hole required by the quantum mechanical rules of momentum conservation. This means that the amount of charge generated by a particle is directly proportional, within a statistical variation, to the energy lost by a particle in the silicon (for particles that pass completely through the silicon) or to the particle's total energy (for particles that stop in the silicon). Particle energies can therefore be found from the number of generated electron-hole pairs. The particle's direction of incidence can be also be found, by constructing a “pin-hole camera” and dividing the detector into individual pixels. The direction is found by determining in which pixel the charge was collected.
The detection of single low energy particles (such as protons with energies between 100 eV and 10 keV found in the solar wind) typically requires a detector that can collect the charge produced by such particles and which can then be read out with sufficient signal to noise ratio. When low energy particles enter a silicon detector, they tend to create a charge cloud very near the surface. Surface fields in ordinary silicon detectors tend to sweep this charge cloud to the surface where it is captured by surface states and neutralized by recombination before it can be collected for detection. In addition, conventional readout schemes are often too noisy and too slow to allow for adequate resolution of particle energies and complete separation of individual particle events. Finally, many detector schemes require thinning of the silicon detector material, which can be difficult, expensive, and time consuming.
FIG. 1
shows a silicon “PIN” diode structure
10
used as a particle detector. One region
12
is doped p-type, and another region
14
is n-type. Between them in an “intrinsic” region
16
that is very lightly doped. The term “PIN” describes this p-type, intrinsic, n-type layer structure. By applying a negative potential
18
to the p-type region and a positive potential to the n-type region, an electric field is created that depletes the it intrinsic region of any free electrons or holes. After the initial depletion, no current normally flows, since the region between the conducting n-type and p-type regions is depleted of carriers.
When a particle or photon is absorbed in the intrinsic region, the electron-hole pairs that the particle generates are swept away from the intrinsic region, with the holes going toward the p-type region and the electrons toward the n-type region. The total number of electron-hole pairs produced is proportional to the particle's incident energy. This creates a current flow that can be detected by detector
11
. Alternatively, the collected charge can be collected by a capacitor, producing a detectable voltage.
Several parameters affect device performance, including dead layer thickness, depletion region thickness, device capacitance, and readout speed and flexibility.
Dead-Layer Thickness
As an energetic particle penetrates silicon, it gradually loses its energy and generates electron-hole pairs. The electron-hole pairs generated in the depletion region will be separated by the applied electric field and detected. However, the depletion region does not extend completely to the surface. There is a “dead layer” near the surface, and electron-hole pairs generated in this region will be collected with only limited efficiency, or not at all. This is particularly important for the detection of low energy particles, since low energy particles penetrate only a short distance into the silicon before their energy is dissipated, and thus all of the electron-hole pair generation is relatively near the surface.
The dead layer has two components, the undepleted silicon layer and the surface depletion layer. The undepleted layer includes the n-type or p-type layer in the PIN structure that is not depleted by the applied electric field. Some thickness of undepleted silicon is needed to serve as a contact in order to apply the electric field. Since it is undepleted, this region is field free, and there is an abundance of majority carriers, both factors contributing to loss of signal. The abundance of majority carriers makes it likely for generated minority carriers to recombine as long as they remain in the region. The lack of an electric field also means that the device must rely on diffusion alone to remove minority carriers from the region. This means a significant fraction of the generated minority carriers will not be detected, but will remain in the undepleted region until they recombine.
There will also be a region at the surface depleted by the surface states. In contrast to the main depletion region set up by the applied electric field, the electric field that exists in the surface depletion region drives generated carriers to the surface or to the undepleted region where they recombine, rather than to the opposite electrodes where they can be detected.
Depletion Layer Thickness
The thickness of the main depletion region determines the fraction of charge collected for high energy particles and the collection efficiency for hard X-rays. If the material is too thin, high energy particles will travel completely through the depletion region without being stopped, and so only a fraction of their energy will be deposited there. Similarly, a thin depletion layer will provide a small collection volume for high energy X-rays, and a significant fraction of the X-ray photons will not be detected, instead being either completely transmitted or absorbed in insensitive parts of the detector.
Also, for back illuminated devices, the generated carriers must travel from the back to the front side without recombining. This requires that the device be depleted from the front to the back. The thickness of the wafer must be such that it can be depleted from front to back with a practical applied voltage.
Device Capacitance
The amount of charge collected is dependent on the energy of the particle or photon. This produces a voltage equal to the charge divided by the capacitance of the detector: The larger the capacitance, the smaller the voltage signal for a given collected charge. Since the readout electronics normally have a fixed noise voltage, and the voltage signal must be larger than this voltage noise for proper discrimination, the detector capacitance determines the minimum detectable charge for a given readout voltage noise.
Readout Speed and Flexibility
The particles impinge randomly on the detector array, each particle generating a charge proportional to its energy. If the collector detects 1000 electrons in one read cycle, however, it cannot discriminate between
1
particle that generates 1000 electrons, or 10 particles that each generate 100 electrons. Therefore, the detector readout must be fast enough so that only one (or at most a few) events happen per each pixel per readout cycle.
A delta-doped hybrid advanced detector (“HAD”) is provided which includes a diode array formed from high resistivity silicon. A high energy particle passing through the silicon generates a cloud of electron-hole pairs that can be collected as signal charge. The construction of the detector allows the detector to see low energy particles and high energy particles simultaneously.
The detector uses the delta-doping scheme first developed for delta-doped charge coupled devices (“CCDs”). Delta-doping places a highly doped layer at the surface to terminate surface drift fields, thereby enabling the collection of the charge gene
Cunningham Thomas J.
Fossum Eric R.
Nikzad Shouleh
Pain Bedabrata
Soli George A.
California Institute of Technology
Fish & Richardson P.C.
Le Que T.
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