Delivery regions for power, ground and I/O signal paths in...

Details Delivery regions for power, ground and I/O signal paths in... Delivery regions for power, ground and I/O signal paths in...

2007-04-24

2007-04-24

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C361S783000, C257S691000, C174S534000, C174S520000

Reexamination Certificate

active

10804800

ABSTRACT:
An integrated circuit (IC) package includes a chip carrier and a chip mounted to the chip carrier. The chip carrier has a centrally located power delivery region and a peripherally located input-output (I/O) delivery region disposed in partially surrounding relationship to the power delivery region. Power and ground paths are disposed in the power delivery region and I/O signal paths are disposed in the I/O delivery region.

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patent: 2003/0198033 (2003-10-01), Panella et al.
patent: 2005/0141206 (2005-06-01), Radhakrishnan et al.

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