Delivery position aligning method for use in a transfer...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature

Reexamination Certificate

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Reexamination Certificate

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07129147

ABSTRACT:
A transfer system has a position aligning device, a mounting device, and a transfer mechanism having two pick. In a delivery position aligning method for use in a transfer system, a set of delivery position coordinates that defines an access point of each pick of the transfer mechanism is temporarily determined. Then, a set of delivery position coordinates of each pick of the transfer mechanism to the position aligning device is fixed, and parts of sets of delivery position coordinates of each pick of the transfer mechanism to devices other than the position aligning device are fixed. A position alignment object is transferred to the position aligning device via a transfer route passing an unfixed set of delivery position coordinates, and an amount of positional displacement thereof is calculated. The unfixed set of delivery position coordinates is corrected based on the amount of positional displacement, and fixed.

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Patent Abstracts of Japan, JP 2001-202123, Jul. 27, 2001 (reference previously filed in Japanese language on Nov. 14, 2005).
Patent Abstracts of Japan, JP 11-207668, Aug. 3, 1999 (reference previously filed in Japanese language on Nov. 14, 2005).

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