Delayed reflow alloy mix solder paste

Metal treatment – Compositions – Fluxing

Patent

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Details

75255, B23K 3534

Patent

active

047674717

ABSTRACT:
A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilizes a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

REFERENCES:
patent: 4255192 (1981-03-01), Burns
patent: 4381944 (1983-05-01), Smith
patent: 4509994 (1985-04-01), Barajas
patent: 4643765 (1987-02-01), Takajo

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