Delayed reflow alloy mix solder paste

Details Delayed reflow alloy mix solder paste Delayed reflow alloy mix solder paste

1987-12-17

1989-09-12

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

228223, 228232, 75255, B23K 3534

Patent

active

048656542

ABSTRACT:
A solder paste mixture for soldering surface mount devices to a circuit board using a reflow soldering process which utilize a vapor phase furnace. The solder paste mixture has a metallic content which is 63% tin and 37% lead. The metallic content of the paste consists of 150 micron particles of 100% tin and 150 micron particles of an alloy of 10% tin and 90% lead. Included in the process of soldering components to the circuit board is the step of prebaking the circuit board with solder paste and components in their proper place on the board.

REFERENCES:
patent: 4373974 (1983-02-01), Barajas
patent: 4509994 (1985-04-01), Barajus

Affiliated with

Also associated with

Rating

Delayed reflow alloy mix solder paste does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Delayed reflow alloy mix solder paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Delayed reflow alloy mix solder paste will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-913582