Delay line device and method of manufacturing the same

Metal working – Method of mechanical manufacture – Electrical device making

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29830, 29841, H01P 1100

Patent

active

054994420

ABSTRACT:
A delay line device having first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of the ceramic substrate identical in thickness and material to the ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.

REFERENCES:
patent: 4641113 (1987-02-01), Ozawa
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4930215 (1990-06-01), Roche et al.
patent: 5032803 (1991-07-01), Koch
patent: 5384952 (1995-01-01), Matsui

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