Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1996-07-01
1998-06-09
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
156344, 384192, 384419, B32B 3500
Patent
active
057627533
ABSTRACT:
Method and apparatus for peeling a layer from a laminate utilizing a peel rod about which the layer is guided during peeling. The peel rod is continuously supported along its length by a bearing sleeve having a longitudinal passage receiving the rod and in turn supported in a holder. The bearing sleeve has a longitudinal opening in its wall communicating with its longitudinal passage, and the edge of the opening forms a continuous scraping edge for scraping debris from the rod. A cleaning pad of SCOTCH BRITE material extends radially through the bearing to engage the rod. The peeling rod and bearing are made of low friction material such as a ceramic, and the rod is preferably driven by a motor.
REFERENCES:
patent: 905355 (1908-12-01), Peckham
patent: 1291021 (1919-01-01), Kiefer
patent: 1428328 (1922-09-01), Hawks
patent: 1550614 (1925-08-01), Hunt
patent: 1816801 (1931-07-01), Vauclain
patent: 2053848 (1936-09-01), Seyfried
patent: 2075595 (1937-03-01), Whiting
patent: 2096923 (1937-10-01), Schwehm
patent: 2162890 (1939-06-01), Horne et al.
patent: 2585017 (1952-02-01), Kostolnik
patent: 2804656 (1957-09-01), Purdy
patent: 2833600 (1958-05-01), Lyons
patent: 2906567 (1959-09-01), Runton et al.
patent: 2964806 (1960-12-01), Naegeli
patent: 3178774 (1965-04-01), Pippin et al.
patent: 3711171 (1973-01-01), Orkin et al.
patent: 3782736 (1974-01-01), Valente
patent: 3842769 (1974-10-01), Maynard
patent: 3918808 (1975-11-01), Narita
patent: 3952654 (1976-04-01), Evans
patent: 3957509 (1976-05-01), McMullen et al.
patent: 4072371 (1978-02-01), Hill et al.
patent: 4205911 (1980-06-01), Dole
patent: 4211484 (1980-07-01), Iwai et al.
patent: 4264191 (1981-04-01), Gerbasi et al.
patent: 4267241 (1981-05-01), Mahrus et al.
patent: 4297021 (1981-10-01), Tani et al.
patent: 4349934 (1982-09-01), Margittai
patent: 4400082 (1983-08-01), Kiba
patent: 4407219 (1983-10-01), Dellevoet
patent: 4427289 (1984-01-01), Oda
patent: 4475807 (1984-10-01), Toyoda et al.
patent: 4489823 (1984-12-01), Gordon
patent: 4501620 (1985-02-01), Oda
patent: 4577363 (1986-03-01), Wyse
patent: 4621386 (1986-11-01), Hill
patent: 4792244 (1988-12-01), Yamashita et al.
patent: 4870466 (1989-09-01), Iida
patent: 4876875 (1989-10-01), Bruggeman et al.
patent: 4878093 (1989-10-01), Edmunds
patent: 4896975 (1990-01-01), Bescoby et al.
patent: 4983468 (1991-01-01), Oda
patent: 5054940 (1991-10-01), Momose et al.
patent: 5083873 (1992-01-01), Momose et al.
patent: 5094550 (1992-03-01), Momose et al.
patent: 5111251 (1992-05-01), Uno et al.
patent: 5127745 (1992-07-01), Momose et al.
patent: 5130755 (1992-07-01), Ikegawa et al.
patent: 5135314 (1992-08-01), Momose et al.
patent: 5146675 (1992-09-01), Ford et al.
patent: 5174660 (1992-12-01), Seibig
patent: 5175591 (1992-12-01), Dunn et al.
patent: 5191381 (1993-03-01), Yuan
patent: 5191672 (1993-03-01), Boston et al.
patent: 5220391 (1993-06-01), Tange
patent: 5258816 (1993-11-01), Haneda et al.
patent: 5265537 (1993-11-01), Gasparrini et al.
patent: 5283621 (1994-02-01), Hashizume
patent: 5284394 (1994-02-01), Lemelston
patent: 5303010 (1994-04-01), Takano et al.
patent: 5307861 (1994-05-01), Townsend
patent: 5317966 (1994-06-01), Hackelborger
patent: 5321482 (1994-06-01), Yano et al.
patent: 5322735 (1994-06-01), Fridez et al.
patent: 5329664 (1994-07-01), Boston et al.
patent: 5457520 (1995-10-01), Schell et al.
Osele Mark A.
Payne Leslie
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