Deformation measuring method and apparatus using electronic...

Details Deformation measuring method and apparatus using electronic... Deformation measuring method and apparatus using electronic...

2005-09-13

2005-09-13

Lee, Andrew H. (Department: 2877)

Optics: measuring and testing

Material strain analysis

By light interference detector

C356S512000, C356S521000

Reexamination Certificate

active

06943870

ABSTRACT:
A deformation measuring method using electronic speckle pattern interferometry comprises the steps of subtracting an average intensity from the intensity in a time domain at each point of a speckle pattern image so as to compute the cosine component of intensity; subjecting the cosine component to Hilbert transform in a temporal domain so as to compute the sine component of intensity; determining the arctangent of the ratio between thus computed sine and cosine components so as to determine an object phase; carrying out an unwrapping operation; and outputting three-dimensional deformation distribution data in a displayable mode.

REFERENCES:
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patent: WO 96/04532 (1996-02-01), None
Wong, W.O. et al., “Quantitative Vibration Amplitude measurement with Time-averaged Digital Speckle Pattern Interferometry”,Optics&Laser Technology, 1998, pp. 317-324, vol. 30.
Agneni, A. et al., “Image Processing for Fringe Unwrapping in Speckle Interferometry”,Proceedings of the International Modal Analysis Conference, 2000, pp. 1479-1484, vol. 2.
Joenathan, C. et al., “Speckle Interferometry with Temporal Phase Evaluation: Influence of Decorrelation, Speckle Size, and Nonlinearity of the Camera”,Applied Optics, Mar. 1999, pp. 1169-1178, vol. 38, No. 7.

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