Deformable thermal pads for optical fibers

Optical waveguides – Accessories

Reexamination Certificate

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C385S094000, C385S147000

Reexamination Certificate

active

07957623

ABSTRACT:
A system for fiber optic packaging includes a first substrate and a first deformable pad coupled to the first substrate. The first deformable pad is characterized by a thermal conductivity greater than 1 W/mK. The system also includes a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad. The system further includes a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.

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