Deformable substrate assembly for adhesively bonded electronic d

Details Deformable substrate assembly for adhesively bonded electronic d Deformable substrate assembly for adhesively bonded electronic d

1997-01-02

1998-02-03

Lam, Cathy F.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428209, 428901, 29829, 29832, 174255, 174257, 174259, 174260, 361762, 361767, 361779, B32B 712, B32B 300, H05K 300, H05K 330

Patent

active

057142521

ABSTRACT:
The present invention relates to a deformable substrate assembly for microelectronic components which includes an array of ductile metal circuit traces on a surface thereof. When an electronic component is adhesively bonded to the substrate assembly, and bonding elements from the component contact the traces, the substrate has material properties which allow individual bonding elements to locally deform the traces until the traces penetrate into the substrate surface.

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Microelectronics Packaging Handbook (Van Nostrand Reinhold, 1989), R.R. Tummala and E.J. Rymaszewski, pp. 280-309; 366-391.
"Achieving COG technique for multi-terminal LSI started with liquid crystal display pocket-size television," Nikkei Microdevices, K. Nakamura, Jun. 1987.

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