Deformable die for use with sealant pads

Details Deformable die for use with sealant pads Deformable die for use with sealant pads

1989-09-22

1991-07-30

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

156580, 1565833, 156 49, 100211, 264313, B30B 100

Patent

active

050357662

ABSTRACT:
Die plates for forming moisture seals about the junctions of wire harnesses afford improved wire separation and contact between the sealant material in a sealant pad and the wires if the opposed die plates have an elastomeric surface, and the opposed surface of at least one plate is radiused causing the sealant material to separate the wires and flow between and around each wire.

REFERENCES:
patent: 2169280 (1939-08-01), Pfanstiehl
patent: 2356225 (1944-08-01), Cunnington
patent: 4135957 (1979-01-01), Voller
patent: 4863535 (1989-09-01), More
patent: 4870251 (1989-09-01), Anemaet
patent: 4878969 (1989-11-01), Janisch
Exhibit A: Electrical Moisture Sealant Pads 09092.

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