Deflagrative electronic component potting compound

Explosive and thermic compositions or charges – Structure or arrangement of component or product – Solid particles dispersed in solid solution or matrix

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149 2, 149 20, 149113, 149114, C06B 4510

Patent

active

041013522

ABSTRACT:
A potting compound, comprising a low viscosity and low temperature curing licone resin, potassium perchlorate, magnesium and boron, for encapsulating electronic equipment and assemblies and which can be used for destroying the electronic components in emergency situations.

REFERENCES:
patent: 3257801 (1966-06-01), Martinez et al.
patent: 3258373 (1966-06-01), Douda
patent: 3309249 (1967-03-01), Allen
patent: 3394218 (1968-07-01), Foudriat
patent: 3411964 (1968-11-01), Douda
patent: 3507837 (1970-04-01), Hidinger
patent: 4025369 (1977-05-01), Price et al.

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