Defective semiconductor redistribution labeling system

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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148 332, 216 65, 216 84, 438 8, 438 14, H01L 2100

Patent

active

060690895

ABSTRACT:
A system for labeling defective semiconductor chips so that such defective chips can be used in secondary or downgraded applications is provided. The system includes identifying defective semiconductor chips which are not fit for their primary purpose. These defective semiconductor chips are labeled with a letter, symbol or other marking which indicates that they are defective. The marking may indicate the degree of defectiveness, or may include a code or other standard set forth by the industry. The label is etched or carved into the semiconductor generally at one or both ends, or at a center portion, using a laser or an engraver or other permanent labeling device. The etching or carving is of a depth which prevents one from knowingly or unknowingly erasing, removing or otherwise obliterating the label. An etching or carving depth of one half the thickness from the top surface of the chip has been found to be effective. Such a location and depth of the label is sufficient to prevent moisture from penetrating to the core of the chip. These labeled chips can then be sold at a reduced price to manufacturers as well as consumers. Because these defective semiconductor chips are properly labeled, they cannot be sold to unknowing manufacturers of electronic devices or consumers as regular (non-defective) semiconductor chips. In addition, by labeling defective semiconductor chips the manufacturer of the chips cannot accidentally sell a defective chip. This system captures the value that defective chips may have for secondary applications.

REFERENCES:
patent: 3664913 (1972-05-01), Ratcliff
patent: 5246539 (1993-09-01), Canestrari et al.
patent: 5814528 (1998-09-01), Ju et al.
patent: 5943549 (1999-08-01), Motoura et al.
patent: 5945349 (1999-08-01), Koo

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