Defect reduction in electrodeposited copper for...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area

Reexamination Certificate

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C205S118000, C205S296000

Reexamination Certificate

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07316772

ABSTRACT:
A method for electroplating a copper deposit onto a semiconductor integrated circuit device substrate having submicron-sized features, and a concentrate for forming a corresponding electroplating bath. A substrate is immersed into an electroplating bath formed from the concentrate including ionic copper and an effective amount of a defect reducing agent, and electroplating the copper deposit from the bath onto the substrate to fill the submicron-sized reliefs. The occurrence of protrusion defects from superfilling, surface roughness, and voiding due to uneven growth are reduced, and macro-scale planarity across the wafer is improved.

REFERENCES:
patent: 3770598 (1973-11-01), Creutz
patent: 3956078 (1976-05-01), Kardos et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4376685 (1983-03-01), Watson
patent: 4555315 (1985-11-01), Barbieri et al.
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6129830 (2000-10-01), Senge et al.
patent: 6425996 (2002-07-01), Dahms et al.
patent: 6444110 (2002-09-01), Barstad et al.
patent: 6673216 (2004-01-01), Pedersen et al.
patent: 2002/0043467 (2002-04-01), Morrissey et al.
patent: 2002/0043468 (2002-04-01), Mikkola et al.
patent: 2002/0053519 (2002-05-01), Morrissey et al.
patent: 2002/0074231 (2002-06-01), Mikkola et al.
patent: 2002/0088713 (2002-07-01), Merricks et al.
patent: 2002/0090484 (2002-07-01), Merricks et al.
patent: 2002/0127847 (2002-09-01), Alling et al.
patent: 2006/0183328 (2006-08-01), Barstad et al.
patent: 2610705 (1978-02-01), None
Declaration of Richard Hurtubise dated Dec. 21, 2004 (3 pages).

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