Defect inspection method and apparatus

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system

Reexamination Certificate

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C356S237100, C356S237200, C356S237300, C356S237400, C356S237500, C356S364000, C356S369000, C356S388000, C356S390000, C356S394000, C382S100000, C382S141000, C382S144000, C382S145000, C382S149000, C702S033000, C702S035000, C702S187000, C702S189000

Reexamination Certificate

active

07664608

ABSTRACT:
A pattern inspection apparatus which compares images of regions, corresponding to each other, of patterns that are formed so as to be identical and judges that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

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