Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2007-09-25
2007-09-25
Bella, Matthew C. (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S145000, C356S237200
Reexamination Certificate
active
11204181
ABSTRACT:
A method of inspecting defects of a plurality of patterns that are formed on a substrate to have naturally the same shape. According to this method, in order to detect very small defects of the patterns with high sensitivity without being affected by irregular brightness due to the thickness difference between the patterns formed on a semiconductor wafer, a first pattern being inspected is detected to produce a first image of the first pattern, the first image is stored, a second pattern being inspected is detected to produce a second image of said second pattern, the stored first image and the second image are matched in brightness, and the brightness-matched first and second images are compared with each other so that the patterns can be inspected.
REFERENCES:
patent: 4633504 (1986-12-01), Wihl
patent: 4669123 (1987-05-01), Kobayashi et al.
patent: 4791586 (1988-12-01), Maeda et al.
patent: 4805123 (1989-02-01), Specht et al.
patent: 4926489 (1990-05-01), Danielson et al.
patent: 5153444 (1992-10-01), Maeda et al.
patent: 5204910 (1993-04-01), Lebeau
patent: 5640200 (1997-06-01), Michael
patent: 5659172 (1997-08-01), Wagner et al.
patent: 5808735 (1998-09-01), Lee et al.
patent: 5949901 (1999-09-01), Nichani et al.
patent: 5963314 (1999-10-01), Worster et al.
patent: 6067153 (2000-05-01), Mizuno
patent: 6111596 (2000-08-01), Haskell et al.
patent: 6118525 (2000-09-01), Fossey et al.
patent: 6128108 (2000-10-01), Teo
patent: 6133576 (2000-10-01), Shafer et al.
patent: 6181805 (2001-01-01), Koike et al.
patent: 6282309 (2001-08-01), Emery
patent: 6504948 (2003-01-01), Schemmel et al.
patent: 55-74409 (1980-06-01), None
patent: 61-212708 (1986-09-01), None
patent: 04-194702 (1992-07-01), None
patent: 06-174652 (1994-06-01), None
patent: 07-153804 (1995-06-01), None
patent: 8-10463 (1996-01-01), None
patent: 9-312318 (1997-12-01), None
Maeda Shunji
Oka Kenji
Shibata Yukihiro
Shishido Chie
Takagi Yuji
Antonelli, Terry Stout & Kraus, LLP.
Bella Matthew C.
Hitachi , Ltd.
Lu Tom Y
LandOfFree
Defect inspection method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Defect inspection method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Defect inspection method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3742715