Semiconductor device manufacturing: process – Repair or restoration
Reexamination Certificate
2006-09-12
2009-06-16
Sefer, A. (Department: 2893)
Semiconductor device manufacturing: process
Repair or restoration
C438S014000, C382S145000, C382S149000, C257SE21252, C257SE21526
Reexamination Certificate
active
07547560
ABSTRACT:
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.
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“Surface Mount Technology Microbridge Detector”, IBM Technical Disclosure Bulletin, vol. 38, No. 5; May 1, 1995; pp. 255-256.
Albers Bradley J.
Brown Gregory
Patterson Oliver Desmond
Shuttleworth David M.
Weck Werner
Agere Systems Inc.
Khan Farid
Sefer A.
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