Defect identification system and method for repairing killer...

Semiconductor device manufacturing: process – Repair or restoration

Reexamination Certificate

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C438S014000, C382S145000, C382S149000, C257SE21252, C257SE21526

Reexamination Certificate

active

07547560

ABSTRACT:
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects in each of the dies, classifying the identified defects as killer or non-critical, for each killer defect determining an action to correct the defect, repairing the defect and returning the wafer to a next process step. Also disclosed is a method for determining an efficient repair process by dividing the die into a grid and using analysis of the grid to find a least invasive repair.

REFERENCES:
patent: 6047083 (2000-04-01), Mizuno
patent: 6205239 (2001-03-01), Lin et al.
patent: 6335129 (2002-01-01), Asano et al.
patent: 6884999 (2005-04-01), Yedur et al.
patent: 7236847 (2007-06-01), Marella
patent: 2005/0224457 (2005-10-01), Satake et al.
patent: 62177681 (1987-08-01), None
patent: 405272940 (1993-10-01), None
“Surface Mount Technology Microbridge Detector”, IBM Technical Disclosure Bulletin, vol. 38, No. 5; May 1, 1995; pp. 255-256.

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