Defect detection and repair of micro-electro-mechanical...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation

Reexamination Certificate

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C438S017000

Reexamination Certificate

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06847907

ABSTRACT:
A method of defect detection and repair of micro-electro-mechanical systems (MEMS) devices comprising the steps of (A) detecting at least one defect in the MEMS device, wherein each defect is an object that prevents the MEMS device from functioning substantially properly; (B) performing repair of each detected defect; (C) checking whether the MEMS device is functioning substantially properly after each detected defect is repaired; and (D) if the MEMS device is not functioning substantially properly after each detected defect is repaired, repeating steps (A-C).

REFERENCES:
patent: 6496351 (2002-12-01), Hill et al.
Pfeifer et al., Quality Control and Process Observation for the Micro Assembly Process, 2001, Elsevier, Measurement 30, pp. 1-18.*
Burns et al., A System for Automatic Electrical and Optical Characterization of Microelectromechanical Devices, Dec. 1999, Journal of Microelectromechanical Systems, vol. 8, No. 4, pp. 473-482.*
Rogers et al., Process Yields for Laser Repair of Aged, stiction-Failed, MEMS Devices, Jun. 2001, Journal of Microelectromechanical Systems, vol. 10, No. 2, pp. 280-285.*
Dias et al., Assembly Analytical Forum Analytical Tool Roadmap White Paper, Jun. 25, 2004, International SEMATECH.

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