Defect analysis

Details Defect analysis Defect analysis

2007-06-29

2011-11-22

Seth, Manav (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C714S724000

Reexamination Certificate

active

08064682

ABSTRACT:
In one embodiment, a method to analyze a semiconductor wafer comprises extracting inline defect data from a data source, counting a total number of inline defects and end-of-line defects, terminating the analysis when the total number of inline defects and end-of-line defects exceeds a threshold, and mapping the inline defects onto the end-of-line defects when the total number of inline defects and end-of-line defects is less than a threshold.

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patent: 2004/0218995 (2004-11-01), Graushar
patent: 2007/0156379 (2007-07-01), Kulkarni et al.

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