Deep ultraviolet microlithography system

Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices

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G21K 504

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active

054882290

ABSTRACT:
A high resolution, deep UV photolithography system includes a deep UV radiation source for generating a beam of narrow wavelength deep ultraviolet radiation along a path, mask receiving structure in the path, a first optical system in the path for homogenizing and shaping the deep UV energy in the path; and a second optical system in the path for directing radiation energy onto the surface of a substrate to be processed, the second optical system including large area mirror structure having a numerical aperture of at least 0.3 and a plurality of refractive elements disposed between the mask receiving structure and the substrate for compensating (reducing) image curvature introduced into the system by the large area mirror structure.

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Bingham et al., "The Priciples of Aberration-Corrected Optical Systems", SPIE, vol. 654, (1985), pp. 88-93.

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