Deep bonding methods and apparatus

Details Deep bonding methods and apparatus Deep bonding methods and apparatus

1981-01-23

1983-12-06

Ramsey, Kenneth J.

Metal fusion bonding

Process

With shaping

228 45, 228 441A, 228179, H01L 2190

Patent

active

044188587

ABSTRACT:
To permit accomplishment of wire bonding at a depth that precludes the use of the conventional clamp adjacent to the bonding tool, a new tool is provided which includes a means for preventing bowing of the wire and a method of using such a tool which substantially obviates any need to feed wire by pushing. The bond is completed at the second circuit point after a special motion which pays out a length of wire sufficient to maintain a loop of wire between the first and second bond points. Another special motion breaks the wire after the second bond and positions and shapes the wire end for making another initial bond.

REFERENCES:
patent: 3128649 (1964-04-01), Avila et al.
patent: 3460238 (1969-08-01), Christy et al.
patent: 4266710 (1981-05-01), Bilane et al.

Affiliated with

Also associated with

Rating

Deep bonding methods and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deep bonding methods and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deep bonding methods and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2026004