Deep access bond head

Details Deep access bond head Deep access bond head

1990-03-08

1991-05-14

Heinrich, Sam

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 41, 228904, B23K 3700

Patent

active

050149008

ABSTRACT:
A wire bonder for bonding semiconductor packages that require a deep access to bond between the semiconductor device bond pads and the bonding area on the package to avoid interference between the bond head and the package pins, the bonder including a bellows actuated wire clamp, a reverse venturi to remove slack from the bonding wire, and a lengthened bonding tool.

REFERENCES:
patent: 3954217 (1976-05-01), Smith
patent: 4202482 (1980-05-01), Sade et al.
patent: 4527730 (1985-07-01), Shirai et al.
patent: 4600138 (1986-07-01), Hill
patent: 4789093 (1988-12-01), Bansemir

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