Decreasing thermal contact resistance at a material interface

Details Decreasing thermal contact resistance at a material interface Decreasing thermal contact resistance at a material interface

2007-05-01

2007-05-01

Leo, Leonard R. (Department: 3744)

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

C165S185000, C361S704000

Reexamination Certificate

active

10306108

ABSTRACT:
A heat sink assembly in which the interface material is chemically bonded to both the heat source material and the heat sink material. The chemical bonding can lower the contact resistance that would otherwise exist using conventional adhesives to attach the heat sink to the heat source. The chemical bonding achieved between the respective materials can be, for example, ionic, covalent or metallic bonds, depending on the characteristic of the materials used to make the heat source, the interface material, and the heat sink.

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