Decoupling capacitor for surface mounted leadless chip carriers,

Details Decoupling capacitor for surface mounted leadless chip carriers, Decoupling capacitor for surface mounted leadless chip carriers,

1987-03-19

1988-03-29

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361321, 361403, 174 52FP, H01G 114, H01G 410, H05K 710

Patent

active

047348186

ABSTRACT:
High frequency noise is decoupled from power supplied to Pin Grid Array (PGA), surface mounted leaded chip carrier and surface mounted leadless chip carrier packages by insertion of a decoupling capacitor between the PGA or leaded chip carrier package and printed circuit board; or by mounting the decoupling capacitor over a leadless chip carrier package. The decoupling capacitor comprises a multi layer capacitive element sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a PGA or leaded chip carrier package, or over a leadless chip carrier package; and correspond to the power and ground pin or lead configuration of that PGA, surface mounted leaded chip carrier and surface mounted leadless chip carrier package.

REFERENCES:
patent: 3264709 (1966-08-01), Lupfer
patent: 3271507 (1966-09-01), Elliott
patent: 3349481 (1967-10-01), Karp
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 4385342 (1983-05-01), Puppolo et al.
patent: 4494169 (1985-01-01), Watson

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