Decoupling capacitor for surface mounted leadless chip carrier,

Details Decoupling capacitor for surface mounted leadless chip carrier, Decoupling capacitor for surface mounted leadless chip carrier,

1987-03-19

1988-03-29

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52FP, H01G 114, H01C 101

Patent

active

047348194

ABSTRACT:
Several embodiments of a decoupling capacitor are described which incorporate at least one multilayer capacitive element and which utilize metallized dielectric (i.e., ceramic) substrates rather than a pair of conductors. Also, several types of multilayer ceramic capacitor elements are disclosed which provide a low induction parallel-plate type capacitive structure. The decoupling capacitor assemblies of the present invention are specifically sized and configured so as to be either received in the space directly below the integrated circuit chip and between the downwardly extending pins of a PGA package or "leaded" chip carrier package or to be mounted directly over a "leadless" chip carrier package.

REFERENCES:
patent: 3264709 (1966-08-01), Lupfer
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 4385342 (1983-05-01), Puppolo et al.
patent: 4494169 (1985-01-01), Watson

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