Decoupling capacitor for surface mounted chip carrier

Details Decoupling capacitor for surface mounted chip carrier Decoupling capacitor for surface mounted chip carrier

1985-08-08

1987-04-14

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 52FP, H01G 114, H01C 101

Patent

active

046583270

ABSTRACT:
High frequency noise is decoupled from power supplied to a surface mounted integrated circuit (IC) chip carrier package by installation of a surface mounted decoupling capacitor between the IC chip carrier package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a pair of conductors and having a plurality of surface mountable leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a surface mounted integrated circuit (IC) chip carrier package and correspond to the power and ground pin configuration of that package.

REFERENCES:
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 4338621 (1982-07-01), Braun
patent: 4439754 (1984-03-01), Madden
patent: 4458291 (1984-07-01), Yanagisawa et al.
patent: 4494169 (1985-01-01), Watson
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4521828 (1985-06-01), Fanning

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