Decoupling capacitor for leadless surface mounted chip carrier

Details Decoupling capacitor for leadless surface mounted chip carrier Decoupling capacitor for leadless surface mounted chip carrier

1987-03-19

1988-06-28

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361321, 361403, H01G 114, H01G 410, H05K 710

Patent

active

047543663

ABSTRACT:
High frequency noise is decoupled from power supplied to a surface mounted integrated circuit (IC) leadless chip carrier package by installation of a surface mounted decoupling capacitor over the IC chip carrier package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit over a surface mounted integrated circuit (IC) leadless chip carrier package and correspond to the power and ground pin configuration of that package.

REFERENCES:
patent: 3264709 (1966-08-01), Lupfer
patent: 3271507 (1966-09-01), Elliott
patent: 4494169 (1985-01-01), Watson

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