Decoupling capacitor design

Details Decoupling capacitor design Decoupling capacitor design

2007-11-27

2007-11-27

Landau, Matthew C. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE29345, C361S306200, C361S734000

Reexamination Certificate

active

10993711

ABSTRACT:
A thin-dielectric unit capacitor is disclosed having a first node coupled to a first circuit connection point and a second node coupled to a second circuit connection point. It further contains a first and second thin-dielectric capacitors connected in series between the first and second nodes, wherein a thickness of a gate dielectric for each thin-dielectric capacitor is less than 50 angstroms.

REFERENCES:
patent: 4929989 (1990-05-01), Hayano
patent: 6051876 (2000-04-01), Gardner et al.
patent: 6347026 (2002-02-01), Sung et al.
patent: 2003/0193771 (2003-10-01), Liao
patent: 10256489 (1998-09-01), None
English translation of JP 10-256489.

Affiliated with

Also associated with

Rating

Decoupling capacitor design does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Decoupling capacitor design, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Decoupling capacitor design will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3886237