Decoupling capacitor closely coupled with integrated circuit

Details Decoupling capacitor closely coupled with integrated circuit Decoupling capacitor closely coupled with integrated circuit

2006-12-05

2006-12-05

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S777000, C257S686000, C361S734000, C361S735000, C361S763000, C361S764000, C361S783000

Reexamination Certificate

active

07145233

ABSTRACT:
An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

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