Decoupling capacitor and method of formation thereof

Details Decoupling capacitor and method of formation thereof Decoupling capacitor and method of formation thereof

1985-05-03

1986-06-10

Griffin, Donald A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29 2542, 174 72B, H01G 114, H01G 700, H01B 700

Patent

active

045946418

ABSTRACT:
A decoupling capacitor is presented including a pair of conductors, each having a lead connected thereto formed from a continuous strip of electrically conductive material (lead frame), the strip having opposing planar surfaces. A pair of dummy leads, each being associated with a conductor, but isolated therefrom, is also formed from the strip. Thereafter, a strip of first insulating material is positioned across from one opposing surface of the conductive strip and a strip of second insulating material having a plurality of openings or windows therein is positioned on the other opposing surface of the conductive strip. The two insulating layers sandwiching the conductive strip are then heat tacked and hot press laminated to form a continuous strip of laminated material. The windows are positioned on the conductive strip to define access opening for the two conductors. Next, drops of solder paste are deposited on each conductor through the windows whereupon a multi-layer monolithic ceramic capacitor is placed through each window, between the two conductors and in contact with the solder paste. The multi-layer capacitor includes first and second conductive end surfaces which are electrically and mechanically bonded respectively to each conductor via the solder (after a reflow process). The multi-layer capacitor is then encapsulated and sealed by placing encapsulant material (i.e., epoxy, silicon, etc.) in the space defined by the window. Finally, the now sealed, laminated and encapsulated decoupling capacitor is severed from the lead frame. The decoupling capacitor of the present invention will thus be both hermetically sealed and automatically insertable for use in conjunction with integrated circuit DIP inserter devices.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 4266091 (1981-05-01), Fukuda
patent: 4399321 (1983-08-01), Gottlieb
patent: 4461924 (1984-07-01), Butt
patent: 4475143 (1984-10-01), Hernandez
patent: 4491895 (1985-01-01), Gottlieb et al.

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