Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-07-29
2008-07-29
Norris, Jeremy C (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C361S792000, C439S066000, C174S261000, C029S832000
Reexamination Certificate
active
10335026
ABSTRACT:
A device comprises a substrate core having power paths through it and an input/output signal routing layer upon the core substrate. An integrated circuit may be arranged on the routing layer such that the integrated circuit is electrically coupled to the substrate core through the routing layer.
REFERENCES:
patent: 5136471 (1992-08-01), Inasaka
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5576519 (1996-11-01), Swamy
patent: 5633479 (1997-05-01), Hirano
patent: 5686790 (1997-11-01), Curtin et al.
patent: 5847936 (1998-12-01), Forehand et al.
patent: 5854512 (1998-12-01), Manteghi
patent: 6274819 (2001-08-01), Li et al.
patent: 6407343 (2002-06-01), Tanaka
patent: 6497943 (2002-12-01), Jimarez et al.
patent: 6760232 (2004-07-01), Smith et al.
patent: 6794581 (2004-09-01), Smith et al.
patent: 6992379 (2006-01-01), Alcoe et al.
patent: 2002/0175669 (2002-11-01), Ziegner et al.
patent: 2005/0129349 (2005-06-01), Tourne
Nair Rajendran
Tang John
Marger & Johnson & McCollom, P.C.
Norris Jeremy C
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