Decoupled integrated circuit package

Details Decoupled integrated circuit package Decoupled integrated circuit package

1984-12-19

1987-01-13

Tolin, G. P.

Electricity: electrical systems and devices

Miscellaneous

339147R, 357 75, 361321, 361386, H05K 118

Patent

active

046369180

ABSTRACT:
High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by providing a metalized ceramic chip either on top of an integrated circuit or on the back side of a circuit board in direct alignment with an integrated circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the integrated circuit.

REFERENCES:
patent: 3277354 (1966-10-01), Ikeda
patent: 3348568 (1967-10-01), Stark
patent: 3646246 (1972-02-01), Olney, Jr.
patent: 3660728 (1972-05-01), Carter
patent: 3753046 (1973-08-01), Towell
patent: 3880493 (1975-04-01), Lockhart, Jr.
patent: 3912984 (1975-10-01), Lockhart, Jr.
patent: 4209754 (1980-06-01), Shiki
patent: 4356532 (1982-10-01), Donaher
patent: 4394713 (1983-07-01), Yoshida
patent: 4521828 (1985-06-01), Fanning

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