Decontamination method for semiconductor wafer handling equipmen

Details Decontamination method for semiconductor wafer handling equipmen Decontamination method for semiconductor wafer handling equipmen

1984-02-27

1985-12-24

Caroff, Marc L.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 26, 134 30, B08B 302

Patent

active

045604177

ABSTRACT:
Semiconductor wafer handling equipment is cleaned and rinsed in a sealed first chamber. Thereafter, the first chamber is unsealed and the handling equipment is moved into a second chamber so that only the handling equipment is introduced into the second chamber. The second chamber is then sealed and the handling equipment is dried therein and thereafter subjected to a stream of ionized gas to eliminate static charge therefrom.

REFERENCES:
patent: 3421211 (1969-01-01), Eaves et al.
patent: 3849831 (1974-11-01), DeVerter et al.
patent: 3958586 (1976-05-01), Schnelle
patent: 4092176 (1978-05-01), Kozai et al.
patent: 4132567 (1979-01-01), Blackwood
patent: 4318749 (1982-03-01), Mayer
patent: 4361163 (1982-11-01), Aigo

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