Decapsulator for decapsulating small plastic encapsulated device

Details Decapsulator for decapsulating small plastic encapsulated device Decapsulator for decapsulating small plastic encapsulated device

1996-07-12

1999-01-05

Nuzzolillo, M.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C23F 102

Patent

active

058557270

ABSTRACT:
An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a source of etchant solution and an etching assembly including an etch plate and a bell jar or cover, the etch plate and bell jar forming an etching chamber. Optionally, an etch cup or fixture is supported by the etch head or the electronic device package is mountable in the chamber directly on the etch head. A source of pressurized gas such as nitrogen provides a positive pressure about 2 PSI to the bell jar and to flow the etchant solution through the etch head and onto an exterior surface of the electronic device package so that the encapsulant is etched and when break out occurs on a side wall of the package, the pressure in the bell jar is vented to a waste reservoir and the pressure at the etchant solution source is reduced so that etchant solution flow is instantly stopped to prevent any damage to the electronic device by excessive etching.

REFERENCES:
patent: 4319922 (1982-03-01), Macdonald
patent: 4344809 (1982-08-01), Wensink
patent: 5127991 (1992-07-01), Lal et al.
patent: 5252179 (1993-10-01), Ellerson et al.
patent: 5271798 (1993-12-01), Sandhu et al.
patent: 5443675 (1995-08-01), Wensink

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