Decapsulator and method for decapsulating plastic encapsulated d

Details Decapsulator and method for decapsulating plastic encapsulated d Decapsulator and method for decapsulating plastic encapsulated d

1996-11-27

1998-07-21

Powell, William

Etching a substrate: processes

Etching to produce porous or perforated article

156345, 216 92, B44C 122

Patent

active

057830983

ABSTRACT:
An apparatus and method for selectively etching an encapsulant forming a package of resinous material around an electronic device includes a source of etchant solution and an etching assembly including an etch plate and a movable cover, the etch plate and cover forming an etching chamber. An etch head is supported by the etch plate and the electronic device package is mountable in the chamber on the etch head. In a first mode of operation a displacement pump pumps a first quantity of etchant solution into the etch head and in a second mode of operation the displacement pump agitates at least part of the first quantity of etchant solution repeatedly into and out of an etched cavity formed on an exterior surface of the electronic device package by reaction of the etchant solution with the resinous material. A waste reservoir and a waste outlet extending from the etch head to the reservoir is also provided. The etch head is easily removable from the etch plate by removal of an etch head retainer.

REFERENCES:
patent: 4344809 (1982-08-01), Wensink
patent: 4359360 (1982-11-01), Harris et al.
patent: 4826556 (1989-05-01), Kobayashi
patent: 5127991 (1992-07-01), Lal et al.
patent: 5252179 (1993-10-01), Ellerson et al.
patent: 5271798 (1993-12-01), Sandhu et al.
Brochure entitled: "B&G Decapsulator", Model 250, B & G International, Soquel, California (6 pages), pre-May 1995.

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