Debris trapping/anti clip for retaining a semiconductor wafer on

Details Debris trapping/anti clip for retaining a semiconductor wafer on Debris trapping/anti clip for retaining a semiconductor wafer on

1994-03-25

1995-10-17

Watson, Robert C.

Work holders

Relatively movable jaws

Means to actuate jaw

269157, 269265, B25B 100

Patent

active

054583225

ABSTRACT:
A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion affixed to a front face of the clip head via an electrically nonconductive rectangularly shaped retainer for substantially reducing voltage arcing between the highly electrically charged plasma used in processing a semiconductor wafer and the clip head.

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patent: 5183245 (1993-02-01), DiNapoli et al.
patent: 5224809 (1993-07-01), Maydan et al.
patent: 5253411 (1993-10-01), DiNapoli et al.
patent: 5280983 (1994-01-01), Maydan et al.

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