Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2007-01-15
2008-12-16
Duverne, Jean F (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
Reexamination Certificate
active
07465173
ABSTRACT:
A de-soldering tool includes an upper heating device having an upper heating element for applying heat to an upper mating structure, the upper mating structure arranged in a pattern matching contacts in an electrical connecter soldered to a printed wiring board; a lower heating device having a lower heating element for applying heat to a lower mating structure, the lower mating structure arranged in a pattern matching the solder connections on the underside of the PWB; a controller applying power to the upper heating element and the lower heating element to liquefy solder on the contacts in the electrical connecter.
REFERENCES:
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patent: 4518110 (1985-05-01), Breske et al.
patent: 4637452 (1987-01-01), Kawakami
patent: 4637542 (1987-01-01), Breske et al.
patent: 4896019 (1990-01-01), Hyun
patent: 5147081 (1992-09-01), Kim
patent: 5549240 (1996-08-01), Urban
patent: 6012624 (2000-01-01), French et al.
patent: 6229124 (2001-05-01), Trucco
Cantor & Colburn LLP
Duverne Jean F
ITT Manufacturing Enterprises Inc.
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