De-coupling capacitor on the top of the silicon die by eutectic

Details De-coupling capacitor on the top of the silicon die by eutectic De-coupling capacitor on the top of the silicon die by eutectic

1993-06-30

1994-11-29

Reynolds, Bruce A.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29 2542, 257724, 361303, 3613063, H01G 103

Patent

active

053695453

ABSTRACT:
A high capacitance/low inductance capacitor module. The module comprises a plurality of conductive power planes that are separated from a plurality of conductive ground planes by layers of dielectric material. The power planes each have opposite extending tabs that are offset from similar tabs extending from the ground planes and which are coupled together by layers of conductive material. Likewise, the tabs of the ground planes are coupled together by additional layers of conductive material. The corresponding power and ground planes are also coupled together by vias located throughout the module. The conductive layers couple both sides of the corresponding conductive planes and provide contact pads for further assembly to a semiconductive die. The module is attached to the semiconductive die by a plurality of gold bumps which are formed on the top surface of the die.

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patent: 4831494 (1989-05-01), Arnold et al.
patent: 4852227 (1989-08-01), Burks
patent: 4916576 (1990-04-01), Herbert et al.
patent: 5095402 (1992-03-01), Hernandez et al.

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