Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1997-06-26
2000-02-08
McDonald, Rodney G.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
2041922, 20419222, 20419223, 20429811, 20429828, C23C 1434, C23C 1450
Patent
active
060224622
ABSTRACT:
A DC sputtering system improved in prevention of fusion of a substrate and electric corrosion of a pallet revolving shaft due to the flow of negative electric charges at the time of production of an optical disk. The system includes a pair of electrodes, a negative electrode and a positive electrode, wherein the negative electrode is composed of a target plate made from a target material such as Si and a backing plate on which the target plate is fixedly placed, and the positive electrode is composed of a pallet disposed opposite to the negative electrode. A substrate of an optical disk is mounted on the positive electrode side through a disk base using an inner peripheral mask and an outer peripheral mask. Each of the inner peripheral mask and the outer peripheral mask is made from or covered with an electrically insulating material such as teflon or ceramic. This prevents the flow of negative electric chargers from being concentrated at the inner peripheral mask and the outer peripheral mask, to thereby protect the substrate from being fused.
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"Thin Film Process", Vossen et al., Academic Press, p. 41, 1978.
Ikeda Etsuro
Kawana Yuji
Suzuki Itaru
McDonald Rodney G.
Sony Corporation
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