DC-DC converter implemented in a land grid array package

Details DC-DC converter implemented in a land grid array package DC-DC converter implemented in a land grid array package

2006-04-11

2006-04-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Regenerative type switching device

C257S133000, C257S698000, C257S341000, C257S343000, C257S401000, C257S728000, C257S725000, C257S724000, C257S773000, C257S706000, C257S786000, C361S760000, C361S768000, C361S720000, C361S712000, C361S783000, C361S767000, C174S252000, C174S262000

Reexamination Certificate

active

07026664

ABSTRACT:
A semiconductor chip package that includes a DC—DC converter implemented with a land grid array for interconnection and surface mounting to a printed circuit board. The package includes a two layer substrate comprising a top surface and a bottom surface. At least one via array extends through the substrate. Each via in a via array includes a first end that is proximate to the top surface of the substrate and a second end that is proximate to the bottom surface of the substrate. At least one die attach pad is mounted on the top surface of the substrate and is electrically and thermally coupled to the via array. The DC—DC converter includes at least one power semiconductor die having a bottom surface that forms an electrode. The power semiconductor die is mounted on a die attach pad such that the bottom surface of the die is in electrical contact with the die attach pad. The bottom of the package forms a land grid array. The land grid array includes external pads that are separated into an interior region and a peripheral region. Each external pad located in the interior region of the land grid array is electrically and thermally coupled a via array.

REFERENCES:
patent: 5019941 (1991-05-01), Craft
patent: 5397916 (1995-03-01), Normington
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 5895234 (1999-04-01), Taniguchi et al.
patent: 6212071 (2001-04-01), Roessler et al.
patent: 6278264 (2001-08-01), Burstein et al.
patent: 6477054 (2002-11-01), Hagerup
patent: 6580597 (2003-06-01), Kanouda et al.
patent: 6611055 (2003-08-01), Hashemi
patent: 6678168 (2004-01-01), Kenny et al.
patent: 6710441 (2004-03-01), Eden et al.
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 2002/0064029 (2002-05-01), Pohjonen
patent: 2002/0172025 (2002-11-01), Megahed et al.
patent: 2003/0039092 (2003-02-01), Kanouda et al.
patent: 2004/0145919 (2004-07-01), Hazucha

Affiliated with

Also associated with

Rating

DC-DC converter implemented in a land grid array package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with DC-DC converter implemented in a land grid array package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and DC-DC converter implemented in a land grid array package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3616922