DC-DC converter implemented in a land grid array package

Details DC-DC converter implemented in a land grid array package DC-DC converter implemented in a land grid array package

2005-09-06

2005-09-06

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S767000, C361S768000, C257S706000, C257S786000, C174S252000

Reexamination Certificate

active

06940724

ABSTRACT:
A semiconductor chip package that includes a DC—DC converter implemented with a land grid array (LGA) package for interconnection and surface mounting to a printed circuit board. The LGA package integrates all required active components of the DC—DC power converter, including a synchronous buck PWM controller, driver circuits, and MOSFET devices. In particular, the LGA package comprises a substrate having a top surface and a bottom surface, with a DC—DC converter provided on the substrate. The DC—DC converter including at least one power silicon die disposed on the top surface of the substrate. A plurality of electrically and thermally conductive pads are provided on the bottom surface of the substrate in electrical communication with the DC—DC converter through respective conductive vias. The plurality of pads include first pads having a first surface area and second pads having a second surface area, the second surface area being substantially larger than the first surface area. Heat generated by the DC—DC converter is conducted out of the LGA package through the plurality of pads.

REFERENCES:
patent: 5019941 (1991-05-01), Craft
patent: 5708566 (1998-01-01), Hunninghaus et al.
patent: 6212071 (2001-04-01), Roessler et al.
patent: 6477054 (2002-11-01), Hagerup
patent: 6611055 (2003-08-01), Hashemi
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 2002/0172025 (2002-11-01), Megahed et al.

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