Data processing apparatus having a liquid heat-dissipating syste

Details Data processing apparatus having a liquid heat-dissipating syste Data processing apparatus having a liquid heat-dissipating syste

1999-09-23

2000-12-05

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 361687, H05K 720

Patent

active

061575372

ABSTRACT:
A data processing apparatus having a liquid heat-dissipating system includes a central processing unit (CPU), a housing to receive the CPU, and a heat conductive member. The housing has a top wall and a top opening in the wall immediately above the CPU. The heat conductive member is mounted on the wall to cover the opening and to transfer heat produced by the CPU from an inside of the housing to an outside of the housing, and has a receiving cavity adapted for receiving a cooling liquid.

REFERENCES:
patent: 5430609 (1995-07-01), Kikinis
patent: 5734550 (1998-03-01), Penniman et al.
patent: 5835348 (1998-11-01), Ishida
patent: 6078495 (2000-06-01), Cipolla et al.

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