Data Exchange Subsystem for use in a modular array processor

Details Data Exchange Subsystem for use in a modular array processor Data Exchange Subsystem for use in a modular array processor

1982-01-26

1985-09-24

Chan, Eddie P.

Boots, shoes, and leggings

370 85, G06F 1516, G06F 1300

Patent

active

045436428

ABSTRACT:
A Data Exchange Subsystem comprising a data bus for transferring data signals, a load for normally maintaining a logical one signal on the data bus, a number of data receivers operatively connected to the data bus for sensing the logic state of the data signal, and a number of data transmitters operatively connected to the data bus for driving their respective data onto the bus. The data transmitter utilize open collector output buffers to force the data signal to a logical zero in response to corresponding data provided to the respective data transmitters, thereby collectively forming a "wired-and" structure, providing the Data Exchange Subsystem with an inherent data conflict resolving capability that may be utilized in data-dependent operations such as data masking.

REFERENCES:
patent: 3701976 (1972-10-01), Shively
patent: 3979728 (1976-09-01), Reddaway
patent: 4065808 (1977-12-01), Schomberg et al.
patent: 4096569 (1978-06-01), Barlow
patent: 4144566 (1979-03-01), Timsit
patent: 4145733 (1979-03-01), Misunas et al.
patent: 4174514 (1979-11-01), Sternberg
patent: 4229792 (1980-10-01), Jensen et al.
patent: 4251861 (1981-02-01), Mago
patent: 4257099 (1981-03-01), Appelt
patent: 4270169 (1981-05-01), Hunt et al.
patent: 4270170 (1981-05-01), Reddaway
patent: 4310879 (1982-01-01), Pandega
patent: 4374414 (1983-02-01), Comfort et al.
patent: 4384273 (1983-05-01), Ackland et al.
patent: 4388686 (1983-06-01), Haid
patent: 4390944 (1983-06-01), Quackenbush et al.
patent: 4402040 (1983-08-01), Evett
patent: 4412285 (1983-10-01), Neches et al.
patent: 4412303 (1983-10-01), Barnes et al.

Affiliated with

Also associated with

Rating

Data Exchange Subsystem for use in a modular array processor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Data Exchange Subsystem for use in a modular array processor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Data Exchange Subsystem for use in a modular array processor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1617447