Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-08
2011-03-08
Datskovskiy, Michael V (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679470, C361S679530, C361S696000, C361S699000, C361S700000, C165S080500, C165S104210, C165S104340, C165S185000, C062S259200, C062S118000, C062S119000, C062S185000, C454S184000
Reexamination Certificate
active
07903404
ABSTRACT:
According to one embodiment, a data center comprises a first data center section comprising one or more equipment element elements. Each computer element has one or more heat generating sources. A second data center section comprises a heat exchanger, the second data center section being substantially segregated from the first section. A heat transfer element is thermally coupled to at least some of the heat generating sources and is further thermally coupled to the heat exchanger.
REFERENCES:
patent: 5440894 (1995-08-01), Schaeffer et al.
patent: 5718628 (1998-02-01), Nakazato et al.
patent: 5743102 (1998-04-01), Thomas et al.
patent: 6973801 (2005-12-01), Campbell et al.
patent: 7012807 (2006-03-01), Chu et al.
patent: 7233491 (2007-06-01), Faneuf et al.
patent: 7511959 (2009-03-01), Belady et al.
patent: 2004/0050231 (2004-03-01), Chu et al.
patent: 2007/0209782 (2007-09-01), Wyatt et al.
patent: 2007/0213881 (2007-09-01), Belady et al.
patent: 2007/0297136 (2007-12-01), Konshak
patent: 2008/0223074 (2008-09-01), Pachai et al.
patent: 2008/0266726 (2008-10-01), Murakami et al.
patent: 2009/0188264 (2009-07-01), Fair et al.
patent: 2009/0201645 (2009-08-01), Kashirajima et al.
patent: 2009/0244829 (2009-10-01), Weber et al.
patent: 2009/0244830 (2009-10-01), Wyatt et al.
patent: 2010/0146996 (2010-06-01), Campbell et al.
patent: 2010/0149754 (2010-06-01), Chapel et al.
patent: WO8902569 (1989-03-01), None
Bash Cullen
Patel Chandrakant
Tozer Robert
Datskovskiy Michael V
Hewlett--Packard Development Company, L.P.
LandOfFree
Data centers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Data centers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Data centers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2690838