Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-02-06
2007-02-06
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S691000, C361S695000, C454S184000, C165S121000
Reexamination Certificate
active
11404169
ABSTRACT:
A modular data center, for housing and cooling electronic equipment, includes multiple housings, a first portion of the housings configured to hold heat-producing electronic equipment and a second portion of the housings configured to hold at least one cooling unit, each of the housings of the first portion having a front and a back and configured to hold the heat-producing electronic equipment such that gas is drawn into the equipment from fronts of the equipment, heated by the equipment to become heated gas, and expelled by the electronic equipment is expelled through the backs of the housings, where the housings are disposed and coupled to form a laterally-enclosed arrangement laterally enclosing a hot region and defining a top opening allowing gas to vertically exit the hot region, and where backs of the housings of the first portion are disposed adjacent to the hot region such that the heat-producing equipment, when mounted to the housings, will expel the heated gas into the hot region.
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IBM Technical Disclosure Bulletin, “Improved Cooling System for Rack-Mounted Equipment”, 31(12):140-141 (1989).
Bean, Jr. John H.
Fink James R.
Held Stephen F.
Johnson Richard J.
Johnson Rollie R.
American Power Conversion Corporation
Datskovskiy Michael
Mintz Levin Cohn Ferris Glovsky and Popeo P.C.
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