Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1996-11-25
1999-03-30
Evans, Elizabeth
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428209, 428211, 4285375, 428901, 235488, 235492, B32B 300
Patent
active
058886249
DESCRIPTION:
BRIEF SUMMARY
This invention relates to a one- or multilayer data carrier with an embedded electronic module, in particular a chip card. Furthermore the invention relates to a production method for such data carriers.
In the past various IC cards have become known which are produced by various methods.
For example EP-B1 0 140 230 discloses an IC card constructed from a plurality of plastic layers and produced by the so-called laminating technique. For this purpose one provides a structure consisting of an upper cover layer, at least one core layer and a lower cover layer. Between the upper cover layer and the core layer one places an electronic module consisting of a substrate on which an integrated circuit with contact surfaces is disposed. This structure is interconnected under the action of heat and pressure, the contact surfaces of the module coming to lie in gaps in the upper cover layer, and the integrated circuit in a gap in the core foil. The compound of plastic layers arises from the layers softening and interconnecting during lamination. In the finished card the module is embedded between the upper cover layer and the core layer.
EP-A1 0 493 738 further discloses an IC card produced by the so-called mounting approach. This technique is characterized in that a card body with a multistep gap is first provided. The electronic module is then introduced into the gap and glued. This is done with a thermally activable adhesive in EP-A1 0 493 738.
The provided card body can first be produced without a gap e.g. by laminating a plurality of plastic layers. In a further step the gap is then produced e.g. by milling.
However the card body can also be produced differently. For example DE-A1 41 42 392 discloses manufacturing the card body by injection molding. One uses an injection mold whose cavity corresponds to the form of a card body. After the cavity has been almost completely filled the gap is produced in the card body during the injection molding process with a movable die which can be moved into the cavity. After completion of the card body the electronic module is glued in by a second step.
Alternatively it is possible to use the movable die directly for pressing the module into the as yet unhardened plastic material of the plastic body. In this case the production of the card body and the embedding of the module are completed in one operation.
IC cards produced by injection molding are also known from EP-B1 0 277 854. Here it is proposed that the electronic module be already inserted in the mold while the plastic material is being injected. The module is fixed in the mold by suction air applied from outside. The module casting for protecting the integrated circuit is formed on a slant and thus held reliably in the card body by the surrounding injection molding material.
In addition to the method steps for producing the card body and embedding the module according to DE-A1 41 42 392 or EP-B1 0 277 854, further measures are to be provided for applying printed images on the card surface. However, EP-B1 0 412 893 discloses an injection molding method for producing IC cards wherein the IC card can be already provided with a graphic element during injection molding. For this purpose a card-sized paper layer printed on both sides is inserted in the mold. After that a transparent plastic material is injected in the mold so that the printed image can be seen from both sides of the card in the finished card body. In this method a gap for the electronic module can either be produced by a die protruding into the mold, or the module can be fixed directly and molded around in the mold.
In the stated methods the one- or multilayer card body consists of plastic material. With the laminating technique the card layers are interconnected under the action of heat and pressure and finally cooled. This takes a relatively long time. Although such cards are produced "in packages" in a stack of so-called multiple-copy sheets, and although the electronic module can already be laminated in during welding of the plastic layers, the throughpu
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patent: 5581065 (1996-12-01), Nishikawa et al.
Barak Renee-Lucia
Haghiri Yahya
Ojster Albert
Evans Elizabeth
Giesecke & Devrient GmbH
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