Damping package for surface acoustic wave devices

Details Damping package for surface acoustic wave devices Damping package for surface acoustic wave devices

1983-05-09

1985-01-15

Nussbaum, Marvin L.

Wave transmission lines and networks

Coupling networks

Delay lines including elastic surface wave propagation means

310313R, 333194, H03H 925, H03H 942, H03H 964

Patent

active

044940912

ABSTRACT:
A surface acoustic wave (SAW) device is fabricated to minimize or eliminate purious signals caused by bulk modes. A backing layer is provided on the bottom surface of the crystal substrate of the SAW device having an acoustic impedance nearly the same as that of the crystal substrate for a family of spurious bulk modes.

REFERENCES:
patent: 2859415 (1958-11-01), Fagen
patent: 4234859 (1980-11-01), Ikushima et al.
patent: 4364017 (1982-12-01), Tokunaga et al.

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