Damage prevention interposer for electronic package and...

Details Damage prevention interposer for electronic package and... Damage prevention interposer for electronic package and...

2007-04-13

2010-06-22

Norris, Jeremy C (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000

Reexamination Certificate

active

07742311

ABSTRACT:
An assembly. The assembly reduces damage to a related electronic package during attachment to a related electronic interconnect structure. The assembly includes an interposer. The interposer has a first side and an opposing second side and has multiple holes formed in the interposer that extend from the first side to the second side. The electronic package is configurable to comprise one or more electronic structures; the interposer is configured for placement between the electronic package and the electronic interconnect structure; the locus of a wall of each of the holes is configured to facilitate insertion of a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure; the wall of each hole is configured to provide complete encirclement of that hole; and the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure.

REFERENCES:
patent: 5796590 (1998-08-01), Klein
patent: 6188131 (2001-02-01), Nereng
patent: 6556455 (2003-04-01), Dibene et al.
patent: 6660563 (2003-12-01), Cromwell
patent: 6791184 (2004-09-01), Deeney
patent: 6998539 (2006-02-01), Andrews et al.
patent: 7196907 (2007-03-01), Zheng

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