Cylindrical magnetron sputtering system

Details Cylindrical magnetron sputtering system Cylindrical magnetron sputtering system

1991-10-04

1994-05-31

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419224, 20429821, 20429824, 20429826, 505731, 505816, 505950, 505475, H01L 3900, C23C 1435, C23C 1456

Patent

active

053170067

ABSTRACT:
An improved cathode for a sputtering system includes a metal cylinder and strips of material bonded to the inside of the metal cylinder and/or material sprayed onto the inside of the metal cylinder. The strips may have various specified compositions and/or configurations and/or other characteristics which enhance the ability of the sputtering system to deposit films of high temperature superconductor material on substrates.

REFERENCES:
patent: 4842704 (1989-06-01), Collins et al.
patent: 5047394 (1991-09-01), Wolfe et al.

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