Cylindrical magnetron sputtering source

Details Cylindrical magnetron sputtering source Cylindrical magnetron sputtering source

1976-09-09

1979-12-18

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1500

Patent

active

041793510

ABSTRACT:
Placement of cylindrical magnets inside of a cylindrical cathode comprising a source of depositing material for sputter depositing of the material upon the interior surface of a substantially cylindrical workpiece, results in improved deposition rates, low power requirements, low workpiece temperatures and purity and cohesiveness in the deposited layer of material.

REFERENCES:
patent: 3354074 (1967-11-01), Kay
patent: 3884793 (1975-05-01), Penfold et al.
patent: 3998718 (1976-12-01), Melliar-Smith
patent: 4041353 (1977-08-01), Penfold et al.
R. J. Hecht et al., J. Vac. Sci Tech., vol. 12, No. 4, Jul./Aug. 1975, pp. 836-841.

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